Subassemblies and Components

The technology includes composites and methods for making the compositions to provide a metal matrix with dispersed inorganic oxide particles and a surface of a bound organofunctional group. The result is sub-micron reinforcement for solder which allows a superior service life especially in microelectronics.

A highly sensitive nano-scale piezoelectric force sensor can be used to measure contact force and its rate of change on nano-objects, promising an advancement in micromanipulation and microassembly technology.

This technology is a patent-pending process for fabricating a reproducible lawn of carbon nanotubes (CNTs) on a semiconductor substrate using a microwave plasma Chemical Vapor Deposition (MPCVD) reactor chamber.

An improved ability of microprobe tips to manipulate small objects is obtained by piezoelectric tips that resist bending as they encounter such objects.

A piezoelectric film deposited on a micro-cantilever atomic force microscope (AFM) probe tip enables the cantilever to remain fully extended, with improved sensing and manipulation of nano-objects.

Using a hollow latex tube as a probe tip with adjustable internal air pressures, nano-objects can be picked up and deposited with good precision, creating new applications.

This technology is a doped ternary semiconductor composition with exceptional figures of merit for thermoelectric generation (heat pump) in many applications.

The invention is a fabrication method for producing thick polymeric or composite parts at high speeds and reduced costs. Conventional processes are decoupled under the new design, which uses photopolymerizable compositions for encapsulating microelectronic or other parts.